Advanced Packaging Workshops

Hands-on semiconductor training projects.

Real Challenges

Our projects immerse trainees in real-world semiconductor challenges, from wafer fabrication nuances to advanced packaging techniques.

Core Modules

• Semiconductor SIP Packaging Assembly Excellence

• Design and Enhancement of Package Performance

• Material Characterization, Reliability Management, and Failure Analysis in Semiconductor Packaging

• Semiconductor Packaging Substrate and Interposers

• From PCB, Surface Mount Technology to joint reliability

• Chiplet and Heterogeneous Integration for Semiconductor packaging

Specialised Modules

• Plating Technologies and Surface Treatments for High-Reliability Packaging

• C4 Flip Chip for Advanced IC Packaging: Materials, Processes, and Reliability

• The BT Substrate Journey in Semiconductor Packaging: Materials, Fabrication, Assembly to Reliability

• Insight to Surface Mount Technology: Material, Process, Equipment and Quality Control

• Backgrinding and Dicing in the Era of 3D IC and Advanced Packaging

• PCB Design & Electrical Performance: From Fabrication, Assembly to Embedded Passive Technologies

• Data-Driven Manufacturing: Unlocking Productivity with TPM, OEE Analytics and Artificial Intelligence

• Corrosion & Delamination in Semiconductor Packaging: Mechanisms, Analysis, Package Enhancement

• Interfacial Adhesion and Surface Finishes in Microelectronics Packaging

• Breaking Down Panel level & Fan-out Wafer-Level Packaging: Design, Assembly, and Competitive Technologies

• Innovations in MEMS Packaging Technologies

• Interconnect Solutions for Chiplet and Heterogeneous Integration: Flip Chip, Thermocompression, and Hybrid Bonding

• A pool of technical expert providing professional Semiconductor workshops

• Acting as a bridge to close the knowledge between academic education to the Semiconductor Industry as well as people making a career conversion to the Semiconductor industry

• Pending HRD Corp funding applications